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RND DC-DC Series Data Sheet
10W SMT Converter ? 3.3V & 5V to ± 15V Dual
Surface Mount Assembly
Soldering:
.
The following instructions must be observed when
soldering the unit. Failure to observe these
instructions may result in failure or significant
degradation of the module performance. Power-One
will not honor any warranty claims arising from failure
to observe these instructions.
This product is approved for forced convection reflow
soldering only.
The curves below define the maximum peak reflow
temperature permissible measured on Pins 1 and
10 of the converter.
The lead-frame is constructed for a high
temperature glass filled, UL94V0 flame retardant,
300
250
200
150
100
50
0
Max. temp. on pins 1 and 10 during reflow
soldering (deg C)
Peak Temperature
(See fig below)
tp
190 – 450 s
Time (s)
diallyl ortho-phthalate moulding compound
commonly used for packaging of electronics
components. It has passed NASA outgassing tests
and is certified to MIL-M-14. The coefficient of
thermal expansion is equivalent to FR4.
Restriction curve above 215oC
Peak temp. at pins 1 and 10 (oC)
245
240
235
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore
they facilitate visual inspection (manual or
automatic). The leads are formed from a 97% Cu
alloy plated with Cu and Sn 90. This material is
commonly used in the manufacture of integrated
circuits. It has good corrosion resistance and
exhibits the nobility inherent to all high copper
alloys. Unlike brasses, this material is essentially
230
225
220
215
210
205
200
10
20
30
40
50
60
tp (s)
immune to stress corrosion cracking. It also exhibits
excellent solderability. It is readily wetted by solders
and performs well in standard solderability tests.
(Dip of Class II or better).
The product is manufactured with a patented
process, which is fully automated, and ‘in-line’. This
ensures that there is no contamination or
mechanical stress on the lead-frame so that the co
planarity and solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application.
Pick & Place Assembly:
The product is designed with a large flat area in the
center of the top surface to serve as a pick up point
for automated vacuum pick and place equipment.
The ‘open board’ construction of the unit ensures
that weight is kept to a minimum. However due to the
relatively large size of the component, a large nozzle
(> 8.0 mm, depending on vacuum pressure) is
recommended for picking and placing.
The unit may also be automatically handled using
‘odd-form’ placement equipment, with mechanical
grippers. For this type of equipment the end edges
of the device, which have no leads and also feature
the greatest dimensional accuracy, should be used
as pick-up points.
MCD10214 Rev. 1.0, 20-Aug-10
Page 13 of 16
www.power-one.com
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